High- speed PCB POFV insertion loss test module

 　　any high- speed PCB to be properly finagled to reduce excrescencies through rudiments analogous as impedance discontinuities in transmission lines, infelicitous plating of the through- hole interconnections or other losses of PCB signal integrity.

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　　Parameters

　　Layers 8L High speed Material PCB

　　Board Thinkness1.6 mm

　　Base MaterialN4000-13SI

　　Min Holes0.2 mm

　　Minimum Line Width/ Clearance ：0.075 mm/0.075 mm

　　Minimum Concurrence between Inner Caste PTH and Line ：0.2 mm

　　Size ：126.451 mm ×103.45 mm

　　Aspect Rate ： 10 1

　　Face treatment ： ENEPIG

　　Thing high speed material, insertion loss test, VIPPO

　　Differential impedance 1008Ω

　　ApplicationsNetwork dispatches

　　What is a High Speed PCB?

　　" High Speed"is generally interpreted to mean circuits where the length of the signal's rising or falling edge is lower than about one-sixth of the transmission line length lower also the transmission line length, also the transmission line length demonstrates lumped line behavior.

　　In a high speed PCB, the rise time is presto enough that the bandwidth for the digital signal can extend into the high MHz or GHz frequence. When this happens, there are certain signalling problems that will be noticed if a board is not designed using high speed PCB design rules. In particular, one might notice

　　1. Unacceptably large flash ringing. This generally occurs when traces are not wide enough, although you need to be careful when making your traces wider ( see the section on Impedance Contorl in PCB Design below). Still, you'll have large overshoot or undershoot in your signal transitions, If flash ringing is fairly large.

　　2. Strong crosstalk. As the signal speed increases ( i.e., as the rise time decreases), capacitive crosstalk can come fairly large as the convinced current exploits capacitive impedance.

　　3. Reflections off of automobilist and receiver factors. Your signals can reflect off of other factors whenever there is an impedance mismatch. Whether or not the impedance mismatch becomes important requires looking at the input impedance, weight impedance, and transmission line characteristic impedance for an interconnect. You can read further about this in the following section.

　　4. Power integrity problems ( flash PDN ripple, ground bounce,etc.). This is another set of necessary problems in any design. Still, flash PDN ripple and any performing EMI can be reduced significantly through proper stackup design and decoupling measures. You can read further about high speed PCB stackup design subsequently in this companion.

　　5. Strong conducted and radiated EMI. The study of working EMI problems is extensive, both at the IC position and the high speed PCB design position. EMI is principally a reciprocal process; if you design your board to have strong EMI immunity, also it will emit lower EMI. Again, ultimate of this boils down to designing the right PCB stackup.

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